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Detrimental nanoscale gas bubble defects seriously hinder the practical applications of nanoimprint lithography in manufacturing of nanoelectronic devices. Here, we present a nanofluidics study on the formation and evolution mechanisms of nanoscale bubble defects in dispensing-based UV-curable nanoimprint lithography processes. Our work indicates that the formation of nanoscale bubble defects is mainly attributed to the pinning of resist spreading edges at the nanostructures or contaminants on the mold/substrate surfaces. Such pinning-induced nanoscale gas bubbles undergo an evolution process governed by the combinational effect of surface pinning and gas dissolution into resist. Such an evolution process results in a prominent drop of the gas pressure inside bubbles and therefore prevents nanoscale gas bubble defects from the complete dissolution into resists. This work identifies the critical mechanisms responsible for the formation of detrimental nanoscale bubble defects and provides important insights for the ultimate elimination of such defects